Nio, a major maker of electric vehicles from China, has developed its first 5nm processor for autonomous driving. The chip comes packing 50 billion transistors, comparable to Nvidia's A100 processor for artificial intelligence (AI) and high-performance computing (HPC) applications. The company believes that its system-on-chip is more advanced than Nvidia's Drive Orin X, which it currently uses for its self-driving systems. Interestingly, the SoC is
聯發科CEO暗示天璣9400進展順利，正在與台積電密切合作3nm芯片
今年聯發科（MediaTek） 帶來 了天璣9300（Density 9300），跳出了傳統架構設計思維，開創性地設計了“全大核”CPU架構，4+4的二叢架構包括了四個超大核（Cortex-X4@3.25 GHz）和四個大核（Cortex-A720@2.0 GHz）。
傳蘋果自研Wi-Fi芯片受阻，或不能按計劃在2025年量產上市
近期有許多關於蘋果自研5G基帶、Wi-Fi和藍牙芯片的傳言，其中還包括聯發科的Wi-Fi芯片通過Apple TV非核心產品線進入蘋果供應鏈的 報道 。一直有消息稱，蘋果希望在2025年的iPhone機型里加入自研5G基帶、Wi-Fi和藍牙
AMD將披露Zen 4c架構內核更多信息，包括頻率等參數
AMD在今年4月發佈了適用於移動手持遊戲設備的Ryzen Z1系列APU，其中定位較低的Ryzen Z1使用了Zen 4+Zen 4c混合架構的Phoenix2芯片，首次將Zen 4c架構內核帶入到消費端市場。
一直以來，AMD都沒有介紹Zen 4c的具體信息，官網缺乏
Intel's mysterious new LGA 4710 Socket pictured
An image of an unknown socket presumably designed for Intel's processors has been published by @Yuuki_Ans , a renowned hardware leaker. The socket in question is called LGA4710 and might be destined for special-use processors from Intel or custom 'off roadmap' system-on-chip designs.
The published images depict a socket entitled 'LGA4710-2' and 'LGA-4677 LGA-4
Intel CEO claims 18A node will at least match TSMC's N2 performance and beat it to market
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Shots fired: As semiconductor manufacturers solidify their 3nm processes and intensify the race toward 2nm, TSMC and Intel have recently traded barbs over which company will have the superior node over the next few years. The Taiwan-based manufacturer is confident in its current path, but Intel aims to reassert dominance in the semiconductor industry by jumping to 2nm before anyone else.
Intel CEO Pat Gelsinger has claimed that its upcoming 1
Firm predicts it will cost $28 billion to build a 2nm fab and $30,000 per wafer, a 50 percent increase in chipmaking costs as complexity rises
Increasingly sophisticated wafer fab tools are needed to produce chips on leading-edge process technologies, thus intensifying costs with each new node. Analysts from International Business Strategies believe that the situation will worsen at 2nm, with chip costs growing by around 50% compared to 3nm processors, reports Nikkei , ultimately resulting in a $30,000 price tag for each wafer of 2nm chips.
IBS estimates that a 2nm-capable fab with a capacity of roughly
蘋果iOS 18代碼泄露：顯示明年iPhone 16全系列採用A18芯片
蘋果在2023年9月13日的秋季新品發佈會上，正式發佈了iPhone 15系列智能手機。其中定位更為高端的iPhone 15 Pro和iPhone 15 Pro Max搭載了新款A17 Pro，而普通的iPhone 15和iPhone 15 Plus搭載的是A16 Bionic。
據Wccftech 報道 ，iOS 18的更新代
Transparent processor found in vintage HP computer – silicon-on-sapphire chip discovered on a humble floppy drive PCB
A mysterious transparent chip has been found in an HP computer, dating back to 1977. Investigations have concluded that the custom chip was formed on a sapphire substrate, and thus, we are seeing a silicon-on-sapphire IC. What was it for? Its function was far more mundane than you might expect – it was a support component on a floppy disk controller.
Computer historian and IC reverse engineering enthusiast Ken Shirriff uncovered this interesting chip by de-capping a
Geekom Readies Mini PCs Powered by Intel "Meteor Lake" and AMD "Hawk Point"
Mini PC designer Geekom is bring three innovative desktops to the 2024 International CES, based on the very latest mobile processors by Intel and AMD. These boxes are hinged on MoDT (mobile on desktop) hardware, meaning that energy efficient mobile processors are crammed into compact desktop cases, and wired out with all the connectivity they can put out. The three mini PC models Geekom is launching includes the IT14 Pro, the A8 Max, and the APro8 Max. The Geekcom IT14 Pro