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Following last month's Meteor Lake announcement, Intel is using CES 2024 this week in Las Vegas for announcing their complete line-up of new Intel Core mobile CPUs as well as completing the line-up of Core 14th Gen desktop processors at 35 and 65 Watt TDPs.

Apple Silicon|Intel

Intel Unveils 14th Gen Core HX Series Processors: Raptor Lake Mobile Refresh with Thunderbolt 5

AnandTech | Jan. 8, 2024, 5 p.m. | Original

During CES 2024, Intel unveiled their latest 14th Generation Core HX series processors for mobile. Consisting of five new SKUs, the Intel 14th Gen Core HX family is a refreshed variant of the previous 13th Gen Core HX series, much akin to the desktop processors such as the Core i9-14900K to the Core i9-13900K; Raptor Lake is again refreshed, this time for mobile.

Consisting of five new SKUs

Apple Silicon

Apple's Vision Pro headset to go on sale in U.S. starting Feb. 2 - Reuters

Reuters | Jan. 8, 2024, 12:13 p.m. | Original

Apple's Vision Pro headset to go on sale in U.S. starting Feb. 2 Reuters

Apple Silicon|Intel

(PR) GIGABYTE's B650E AORUS Elite X AX ICE Features Native USB-C 40 Gbps Support for AMD Ryzen 8000 Series Processors

TechPowerUp News | Jan. 8, 2024, 10:30 a.m. | Original

GIGABYTE Technology, a leading global powerhouse in motherboards, graphics cards, and cutting-edge hardware solutions, proudly unveils the world's first motherboard designed to seamlessly support the native USB-C 40 Gbps signal when paired with the cutting-edge AMD Ryzen 8000 series processors.

"We are thrilled to introduce a motherboard that not only supports the cutting-edge AMD Ryzen 8000 series processors but also incorporates advanced features that cater to the evolving needs of our users. This marks a significant

Apple Silicon|Intel

AMD Announces Ryzen 8000G Series Desktop APUs, Select Models Feature Ryzen AI

TechPowerUp News | Jan. 8, 2024, 10:30 a.m. | Original

AMD today announced the Ryzen 8000G line of desktop APUs. These come in the Socket AM5 package, and are supported by all motherboards based on the AMD X670/E, B650/E, and A620 chipsets, with some requiring UEFI firmware updates. Since USB BIOS Flashback is standard issue on AMD motherboards, this should be no problem. With Ryzen 7000 series "Raphael" desktop processors that debut the "Zen 4" microarchitecture,

Apple Silicon

傳三星Galaxy定製版第三代驍龍8移動平台分兩個版本：存在頻率差異

EXPREVIEW | Jan. 7, 2024, 9 p.m. | Original

Deleted

標準版的第三代驍龍8移動平台已於2023年10月發佈，其CPU採用了1+5+2架構，其中超大核Cortex-X4的最高頻率為3.30GHz。而熟悉手機產品的朋友應該知道，每年三星的旗艦手機Galaxy S系列的SoC都會採用定製版的驍

Apple Silicon|Intel

Samsung's 990 Evo is the world's first hybrid PCIe 4.0 x4 and 5.0 x2 SSD — FrankenSSD has two different interfaces with two different lane widths

Tom's Hardware | Jan. 7, 2024, 11:38 a.m. | Original

(Image credit: Samsung)

Samsung has accidentally published the product page for its upcoming 990 Evo NVMe SSD, complete with marketing and hardware specifications (via WinFuture ). Although Samsung is mostly known for making top-end SSDs like its 990 Pro , the 990 Evo is a firmly midrange drive thanks to its reads and writes of just 5,000MB/s and 4,200MB/s respectively. However, the 990 Evo is unique in its

Apple Silicon

Grab the Apple MacBook Air M1 for just $750 brand new

TechSpot News | Jan. 6, 2024, 7:23 a.m. | Original

Offering excellent performance and versatility even a couple of years after launch, the MacBook Air M1 remains a solid choice for those looking for a lightweight and well constructed laptop.

Read Entire Article

Apple Silicon

技嘉特定AM5主板與AMD Ryzen 8000G系列搭配，可獲得USB4功能

EXPREVIEW | Jan. 6, 2024, 4 a.m. | Original

此前AMD在“Advancing AI”活動上發佈了代號為“Hawk Point”的Ryzen 8040系列移動處理器，沿用了台積電（TSMC）的4nm工藝，CPU和GPU仍然為原來的Zen 4和RDNA 3架構，但Ryzen AI更名為NPU，繼續使用XDNA架構，提供了更強的算力。近期有消息稱，接

Apple Silicon|Intel

Huawei's 5nm Kirin 9006C laptop chip was reportedly produced by TSMC in 2020, dispelling SMIC production rumors

Tom's Hardware | Jan. 5, 2024, 1:26 p.m. | Original

(Image credit: TechInsights)

A recent teardown by TechInsights revealed that Huawei's HiSilicon Kirin 9006C processor used in the Qingyun L540 laptop was made using a 5nm-class process technology. However, it was made by TSMC in Taiwan and not by blacklisted SMIC in mainland China, reports Bloomberg . This finding challenges the assumption that SMIC had developed its own 5nm-class production node for high-volume manufacturing (HVM).

Huawei's HiSilicon Kirin 9006

Intel Announces Core 14th Gen 35/65 Watt Desktop CPUs, 14th Gen HX Mobile CPUs

Intel Unveils 14th Gen Core HX Series Processors: Raptor Lake Mobile Refresh with Thunderbolt 5

Apple's Vision Pro headset to go on sale in U.S. starting Feb. 2 - Reuters

(PR) GIGABYTE's B650E AORUS Elite X AX ICE Features Native USB-C 40 Gbps Support for AMD Ryzen 8000 Series Processors

AMD Announces Ryzen 8000G Series Desktop APUs, Select Models Feature Ryzen AI

傳三星Galaxy定製版第三代驍龍8移動平台分兩個版本：存在頻率差異

Samsung's 990 Evo is the world's first hybrid PCIe 4.0 x4 and 5.0 x2 SSD — FrankenSSD has two different interfaces with two different lane widths

Grab the Apple MacBook Air M1 for just $750 brand new

技嘉特定AM5主板與AMD Ryzen 8000G系列搭配，可獲得USB4功能

Huawei's 5nm Kirin 9006C laptop chip was reportedly produced by TSMC in 2020, dispelling SMIC production rumors

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