Die shots of Meteor Lake's SoC and GPU tiles have come out with a detailed view of each individual core and component inside the two chips (via @9550pro on X ). Intel previously showed die shots of the CPU tile , but this is the first time we've seen what the SoC and GPU tiles look like under the hood.
Although they were designed by Intel, the SoC and GPU tiles are manufactured at TSMC on the company's 6
RISC-V-based processors have been making inroads into a wide range of applications, from tiny microcontrollers to data center processors. However, RISC-V hasn't been used for many consumer or gaming devices (except, perhaps, in the form of the microcontrollers mentioned above). Sipeed is a Chinese company trying to change that with its Lichee Pocket 4A console, one of the industry's first RISC-V-based handhelds, targeting mobile gaming.
Sipeed officially positions
The year was 2020, and Huawei released its HiSilicon Kirin 9000, an application processor for smartphones that used TSMC's N5 (5nm-class) process technology and packed 15.3 billion transistors — just before the company got listed on the Entity List of the U.S. government and lost access to TSMC. In 2023, the company launched its Kirin 9000S : a version of the Kirin 9
在今年的驍龍峯會期間，高通 宣佈 推出其迄今為止面向PC打造的最強計算處理器：驍龍X Elite。高通對驍龍X Elite寄予厚望，認為這款開創性平台將開啟計算新時代，顯著提升PC體驗。不少人都想知道，針對Windows on Arm設計的驍龍X Elite，
Why it matters: Qualcomm is making some bold yet unconfirmed claims about the capabilities of its latest Arm chip. The company claims the Snapdragon X Elite is much faster than Apple M3 chips, even though user experience may vary.
Qualcomm recently announced the Snapdragon X Elite system-on-chip (SoC) device as a new laptop-class Arm processor, stating that it was so powerful it would beat Intel and AMD
While artificial intelligence dominated the tech news headlines, 2023 was quietly a strong year for PC hardware and other enthusiast tech. For the most part, prices either stayed steady or fell on key components while systems and devices got faster.
The price of SSDs continued to fall while we saw a new generation of PCIe 5 drives break previous speed records. AMD retook the gaming crown with its Ryzen 7000X3D series of chips while Intel spent most
今年聯發科（MediaTek） 帶來 了天璣9300（Density 9300），跳出了傳統架構設計思維，開創性地設計了“全大核”CPU架構，4+4的二叢架構包括了四個超大核（Cortex-X4@3.25 GHz）和四個大核（Cortex-A720@2.0 GHz），
